Serial Number:
76214446
Mark:
BLUELINE
Status:
Abandoned-No Statement of Use filed
Status Date:
04-02-2005
Filing Date:
Registration Number:
N/A
Registration Date:
N/A
Industrial adhesives, namely resin-based adhesives for attaching electronic components to circuit substrates, resin-based capillary underfill, resin-based no-flow underfill and resin-based water-level underfill, and electronic component packaging materials, namely resin-based transfer molding compound materials and resin-based encapsulant materials used to enclose or protect semiconductor devices, all for use in the manufacture of electronic component assemblies and radio frequency component assemblies cleaning materials for use in removing flux residues from soldered assemblies industrial and metal-based materials, namely laminates, solder, solder alloys, solder paste, solder flux and coated flux for use in the manufacture of electronic components assemblies and radio frequency component assemblies
Mark Description:
N/A
Class:
Common metals and their alloys
Type of Mark:
Trademark
Published for Opposition Date:
07-09-2002
Owner:
Mark Drawing Status:
Design plus Words, Letters, and/or Numbers
Abandon Date:
04-02-2005
Business Name:
BARLOW JOSEPHS & HOLMES LTD
Correspondent Name:
