Serial Number:
79128976
Mark:
C P C
Status:
Status Date:
10-12-2023
Filing Date:
Registration Number:
4476584
Registration Date:
02-04-2014
Heat radiation transfer components for semiconductor devices made of composite materials composed of copper and molybdenum; heat spreaders for semiconductor devices made of composite materials composed of copper and molybdenum; heat radiation components for semiconductor devices; heat spreaders for semiconductor devices [ Composite materials composed of copper and molybdenum for heat radiation and transfer; non-ferrous metals and their alloys ]
Mark Description:
N/A
Class:
Scientific
Type of Mark:
Trademark
Published for Opposition Date:
11-19-2013
Owner:
Mark Drawing Status:
Words, Letters, and/or Numbers in Stylized Form
Abandon Date:
N/A
Business Name:
2000 PENNSYLVANIA AVENUE NW, SUITE 9000
Correspondent Name:
