CASCADE ETCH
associated with 95 other trademarks
Wafer handling platform for precision surface processing (PSP) systems for semiconductor fabrication equipment, namely, wafer handling arms, wafer han...

Words that describe this trademark:

semiconductor wafers  psp systems  surface processing  precision surface  systems  hardware  wafers  processing  chamber 

Serial Number:

87891006

Mark:

CASCADE ETCH

Status:

Abandoned-No Statement of Use filed

Status Date:

01-20-2020

Filing Date:

Registration Number:

N/A

Registration Date:

N/A

Goods and Services:

Wafer handling platform for precision surface processing (PSP) systems for semiconductor fabrication equipment, namely, wafer handling arms, wafer handling components, namely, wafer chucks and end-effectors, industrial robots and operating software sold as an integral component thereof, wafer aligners and wafer handling industrial robots for use in the field of semiconductor fabrication

Mark Description:

N/A

Class:

Machines and machine tools

Type of Mark:

Trademark

Published for Opposition Date:

04-23-2019

Mark Drawing Status:

Standart Character Mark

Abandon Date:

01-20-2020

Business Name:

BOYLE FREDRICKSON S.C.

Correspondent Name:

Recent Trademark filings by this company