CLAM SEALED PACKAGE
By: KYOCERA CORPORATION
associated with 19 other trademarks
HOUSINGS FOR ELECTRONIC COMPONENTS, NAMELY PACKAGES WITH OPTICAL FIBER CONNECTIONS FOR HOUSING SEMICONDUCTOR DEVICES, PHOTOSEMICONDUCTOR DEVICES, AND ...

Words that describe this trademark:

electronic components  connections housing  optical fiber  semiconductor devices  fiber connections  devices  packages  components  housing  housings 

Serial Number:

78287884

Mark:

CLAM SEALED PACKAGE

Status:

Abandoned-No Statement of Use filed

Status Date:

09-02-2007

Filing Date:

Registration Number:

N/A

Registration Date:

N/A

Goods and Services:

HOUSINGS FOR ELECTRONIC COMPONENTS, NAMELY PACKAGES WITH OPTICAL FIBER CONNECTIONS FOR HOUSING SEMICONDUCTOR DEVICES, PHOTOSEMICONDUCTOR DEVICES, AND OPTOELECTRONIC DEVICES

Mark Description:

N/A

Class:

Scientific

Type of Mark:

Trademark

Published for Opposition Date:

12-07-2004

Owner:

Mark Drawing Status:

Typed Drawing

Abandon Date:

09-02-2007

Business Name:

HOGAN & HARTSON LLP

Correspondent Name:

Recent Trademark filings by this company