CPU PAD
By: BERGQUIST COMPANY, THE
associated with 11 other trademarks
electrically insulative, thermally conductive interface for solid-state electronic devices

Words that describe this trademark:

thermally conductive  electronic devices  devices  solidstate  electrically  conductive  interface  insulative 

Serial Number:

75316327

Mark:

CPU PAD

Status:

Cancelled-Section 8

Status Date:

05-21-2005

Filing Date:

Registration Number:

2183148

Registration Date:

08-18-1998

Goods and Services:

electrically insulative, thermally conductive interface for solid-state electronic devices

Mark Description:

N/A

Class:

Rubber

Type of Mark:

Trademark

Published for Opposition Date:

N/A

Owner:

Mark Drawing Status:

Typed Drawing

Abandon Date:

N/A

Business Name:

HAUGEN AND NIKOLAI PA

Correspondent Name:

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