DENSE-PAC MICROSYSTEMS
By: DENSE-PAC MICROSYSTEMS, INC.
associated with 13 other trademarks
ELECTRONIC COMPONENTS, NAMELY PACKAGED INTEGRATED CIRCUITS, MEMORY MODULES, AND LOGIC MODULES

Words that describe this trademark:

memory modules  integrated circuits  logic modules  electronic components  packaged  modules  components  circuits 

Serial Number:

75764105

Mark:

DENSE-PAC MICROSYSTEMS

Status:

Abandoned-Failure to Respond

Status Date:

12-04-2001

Filing Date:

Registration Number:

N/A

Registration Date:

N/A

Goods and Services:

ELECTRONIC COMPONENTS, NAMELY PACKAGED INTEGRATED CIRCUITS, MEMORY MODULES, AND LOGIC MODULES

Mark Description:

N/A

Class:

Scientific

Type of Mark:

Trademark

Published for Opposition Date:

N/A

Owner:

Mark Drawing Status:

Typed Drawing

Abandon Date:

08-29-2001

Business Name:

STETINA BRUNDA GARRED & BRUCKER

Correspondent Name:

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