DI PAK THE FUTURE OF CERAMIC PACKAGING
By: DIELECTRIC LABORATORIES, INC.
associated with 6 other trademarks
Ceramic packaging for integrated circuits and electronic devices, namely, transistors, transducers and combinations thereof

Words that describe this trademark:

integrated circuits  circuits electronic  ceramic packaging  electronic devices  devices  thereof  packaging  transducers  combinations  transistors 

Serial Number:

75370818

Mark:

DI PAK THE FUTURE OF CERAMIC PACKAGING

Status:

Abandoned-No Statement of Use filed

Status Date:

08-23-2000

Filing Date:

Registration Number:

N/A

Registration Date:

N/A

Goods and Services:

Ceramic packaging for integrated circuits and electronic devices, namely, transistors, transducers and combinations thereof

Mark Description:

The mark consists of the stylized wording "DI PAK", the phrase "THE FUTURE OF CERAMIC PACKAGING", and the design of a sphere with a stylized letter "D" on the surface.

Class:

Scientific

Type of Mark:

Trademark

Published for Opposition Date:

11-30-1999

Owner:

Mark Drawing Status:

3T07

Abandon Date:

08-23-2000

Business Name:

TRAIPANI & MOLLDREM

Correspondent Name:

Recent Trademark filings by this company