Serial Number:
75370818
Mark:
DI PAK THE FUTURE OF CERAMIC PACKAGING
Status:
Abandoned-No Statement of Use filed
Status Date:
08-23-2000
Filing Date:
Registration Number:
N/A
Registration Date:
N/A
Ceramic packaging for integrated circuits and electronic devices, namely, transistors, transducers and combinations thereof
Mark Description:
The mark consists of the stylized wording "DI PAK", the phrase "THE FUTURE OF CERAMIC PACKAGING", and the design of a sphere with a stylized letter "D" on the surface.
Class:
Scientific
Type of Mark:
Trademark
Published for Opposition Date:
11-30-1999
Mark Drawing Status:
3T07
Abandon Date:
08-23-2000
Business Name:
TRAIPANI & MOLLDREM
Correspondent Name: