DPAC TECHNOLOGIES
By: DENSE-PAC MICROSYSTEMS, INC.
associated with 13 other trademarks
Electronic components, namely packaged integrated circuits, memory modules and logic modules

Words that describe this trademark:

memory modules  integrated circuits  logic modules  electronic components  packaged  modules  components  circuits 

Serial Number:

76209055

Mark:

DPAC TECHNOLOGIES

Status:

Cancelled-Section 8

Status Date:

01-09-2010

Filing Date:

Registration Number:

2722115

Registration Date:

06-03-2003

Goods and Services:

Electronic components, namely packaged integrated circuits, memory modules and logic modules

Mark Description:

N/A

Class:

Scientific

Type of Mark:

Trademark

Published for Opposition Date:

03-26-2002

Owner:

Mark Drawing Status:

Typed Drawing

Abandon Date:

N/A

Business Name:

STETINA BRUNDA GARRED & BRUCKER

Correspondent Name:

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