DTI DTI
associated with 1 other trademarks
components used in packaging integrated circuits, namely, an insulated wafer and substrate material fabricated from silicon or Bismaleeimide Triazine ...

Words that describe this trademark:

used packaging  substrate material  integrated circuits  wafer substrate  components  material  insulated  circuits  fabricated  packaging 

Serial Number:

75547850

Mark:

DTI DTI

Status:

Cancelled-Section 8

Status Date:

03-28-2009

Filing Date:

Registration Number:

2585686

Registration Date:

06-25-2002

Goods and Services:

components used in packaging integrated circuits, namely, an insulated wafer and substrate material fabricated from silicon or Bismaleeimide Triazine (BT resin) laminate for use in packaging an integrated circuit chip into a plastic ball-grid array package which constitutes a part of the packaged integrated circuit

Mark Description:

The mark consists of two stylizations of the letters "DTI".

Class:

Scientific

Type of Mark:

Trademark

Published for Opposition Date:

05-30-2000

Mark Drawing Status:

5S19

Abandon Date:

N/A

Business Name:

ARNOLD, WHITE & DURKEE

Correspondent Name:

Recent Trademark filings by this company