DTI DAYSHINE TECHNOLOGY INC.
associated with 1 other trademarks
components used in packaging integrated circuits, namely, an insulated wafer and substrata material fabricated from silicon or Bismaleeimide Triazine ...

Words that describe this trademark:

used packaging  integrated circuits  components  material  insulated  circuits  wafer  fabricated  packaging  substrata 

Serial Number:

75547340

Mark:

DTI DAYSHINE TECHNOLOGY INC.

Status:

Cancelled-Section 8

Status Date:

01-31-2009

Filing Date:

Registration Number:

2564021

Registration Date:

04-23-2002

Goods and Services:

components used in packaging integrated circuits, namely, an insulated wafer and substrata material fabricated from silicon or Bismaleeimide Triazine (BT resin) laminate for use in packaging an integrated circuit chip into a plastic ball-grid array package which constitutes a part of the packaged integrated circuit

Mark Description:

The mark consists in part of two stylizations of the letters DTI.

Class:

Scientific

Type of Mark:

Trademark

Published for Opposition Date:

08-15-2000

Mark Drawing Status:

3T07

Abandon Date:

N/A

Business Name:

FULBRIGHT & JAWORSKI LLP

Correspondent Name:

Recent Trademark filings by this company