E-PASSIVE INTERPOSER
associated with 93 other trademarks
SEMICONDUCTOR SUBSTRATES; POLYAMIDE THIN FILM MULTILAYER SUBSTRATES FOR SEMICONDUCTORS; SEMICONDUCTOR CHIP PACKAGES; INTERPOSERS FOR SEMICONDUCTORS; P...

Words that describe this trademark:

thin film multilayer  chip packages  semiconductor chip  film  multilayer  semiconductors  polyamide  semiconductor  substrates 

Serial Number:

76341620

Mark:

E-PASSIVE INTERPOSER

Status:

Abandoned-Failure to Respond

Status Date:

06-27-2003

Filing Date:

Registration Number:

N/A

Registration Date:

N/A

Goods and Services:

SEMICONDUCTOR SUBSTRATES; POLYAMIDE THIN FILM MULTILAYER SUBSTRATES FOR SEMICONDUCTORS; SEMICONDUCTOR CHIP PACKAGES; INTERPOSERS FOR SEMICONDUCTORS; PRINTED CIRCUIT BOARDS; PRINTED WIRING BOARDS, CERAMIC PACKAGES AND SUBSTRATES USED IN THE MANUFACTURE OF INTEGRATED CIRCUITS AND PRINTED CIRCUITS

Mark Description:

N/A

Class:

Scientific

Type of Mark:

Trademark

Published for Opposition Date:

N/A

Mark Drawing Status:

Typed Drawing

Abandon Date:

04-09-2003

Business Name:

STAAS & HALSEY LLP

Correspondent Name:

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