ELECTROVAC WORLDWIDE
associated with 0 other trademarks
Hermetic glass-to-metal packages to encapsulate electronic components Direct bonded copper substrates and heat sinks to support electronic components ...

Words that describe this trademark:

electronic components  bonded copper  copper substrates  heat sinks  components direct  packages  encapsulate  direct  hermetic  substrates 

Serial Number:

75864299

Mark:

ELECTROVAC WORLDWIDE

Status:

Abandoned-Failure to Respond

Status Date:

01-29-2001

Filing Date:

Registration Number:

N/A

Registration Date:

N/A

Goods and Services:

Hermetic glass-to-metal packages to encapsulate electronic components Direct bonded copper substrates and heat sinks to support electronic components Thermostats to control over-heating of small and major appliances Oxygen and humidity sensors for medical applications and combustion control

Mark Description:

N/A

Class:

Scientific

Type of Mark:

Trademark

Published for Opposition Date:

N/A

Mark Drawing Status:

Design plus Words, Letters, and/or Numbers

Abandon Date:

12-01-2000

Business Name:

DIVISION OF ELECTROVAC

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