Serial Number:
77869721
Mark:
ELEMENT
Status:
Cancelled-Section 8
Status Date:
02-28-2020
Filing Date:
Registration Number:
4372801
Registration Date:
07-23-2013
non-abrasive polishing pads for chemical-mechanical planarizing or chemical-mechanical polishing (CMP) machines for use in the manufacture of semiconductor wafers, integrated circuits, hard disk drives and chipsets
Mark Description:
N/A
Class:
Machines and machine tools
Type of Mark:
Trademark
Published for Opposition Date:
04-13-2010
Mark Drawing Status:
Standart Character Mark
Abandon Date:
N/A
Business Name:
N/A
Correspondent Name:
