Serial Number:
78843235
Mark:
ELITECSP
Status:
Cancelled-Section 8
Status Date:
06-08-2018
Filing Date:
Registration Number:
3332305
Registration Date:
11-06-2007
Custom manufacture of semiconductor wafers and chips, namely, solder bumps on electroless metal under bump metallurgy incorporating the adherence of solder spheres to electroless metal on semiconductor wafers and chips
Mark Description:
N/A
Class:
Treatment of materials.
Type of Mark:
Servicemark
Published for Opposition Date:
11-14-2006
Owner:
Mark Drawing Status:
Standart Character Mark
Abandon Date:
N/A
Business Name:
GREENBERG TRAURIG LLP
Correspondent Name:
