ELITEFC
associated with 5 other trademarks
Custom manufacture of semiconductor wafers and chips, namely, solder bumps on electroless metal under bump metallurgy incorporating the adherence of s...

Words that describe this trademark:

metal under  custom manufacture  semiconductor wafers  wafers chips  solder bumps  under bump  chips  electroless  bumps  manufacture 

Serial Number:

78841899

Mark:

ELITEFC

Status:

Cancelled-Section 8

Status Date:

06-08-2018

Filing Date:

Registration Number:

3332289

Registration Date:

11-06-2007

Goods and Services:

Custom manufacture of semiconductor wafers and chips, namely, solder bumps on electroless metal under bump metallurgy incorporating the adherence of solder spheres to electroless metal on semiconductor wafers and chips

Mark Description:

N/A

Class:

Treatment of materials.

Type of Mark:

Servicemark

Published for Opposition Date:

11-14-2006

Mark Drawing Status:

Standart Character Mark

Abandon Date:

N/A

Business Name:

GREENBERG TRAURIG LLP

Correspondent Name:

Recent Trademark filings by this company