GAP PAD VO SOFT
By: BERGQUIST COMPANY, THE
associated with 11 other trademarks
electrically insulative, thermally conductive interface for mounting semiconductor devices onto chassis, heat sinks or printed circuitry boards

Words that describe this trademark:

thermally conductive  semiconductor devices  mounting  onto  devices  conductive  interface  electrically  chassis  insulative 

Serial Number:

75316326

Mark:

GAP PAD VO SOFT

Status:

Cancelled-Section 8

Status Date:

04-08-2011

Filing Date:

Registration Number:

2383584

Registration Date:

09-05-2000

Goods and Services:

electrically insulative, thermally conductive interface for mounting semiconductor devices onto chassis, heat sinks or printed circuitry boards

Mark Description:

N/A

Class:

Scientific

Type of Mark:

Trademark

Published for Opposition Date:

09-01-1998

Owner:

Mark Drawing Status:

Typed Drawing

Abandon Date:

N/A

Business Name:

HAUGEN LAW FIRM PLLP

Correspondent Name:

Recent Trademark filings by this company