GIGAMODULES
By: DST MODULES, INC.
associated with 3 other trademarks
Stacked packages of semiconductor memory units via direct connection between leads

Words that describe this trademark:

via direct  direct connection  memory units  connection between  semiconductor memory  packages  between  stacked  units  leads 

Serial Number:

75705373

Mark:

GIGAMODULES

Status:

Abandoned-Express

Status Date:

06-12-2001

Filing Date:

Registration Number:

N/A

Registration Date:

N/A

Goods and Services:

Stacked packages of semiconductor memory units via direct connection between leads

Mark Description:

N/A

Class:

Scientific

Type of Mark:

Trademark

Published for Opposition Date:

N/A

Owner:

Mark Drawing Status:

Typed Drawing

Abandon Date:

03-07-2001

Business Name:

BERLINER COHEN

Correspondent Name:

Recent Trademark filings by this company