Serial Number:
73162765
Mark:
HI-TEK
Status:
Cancelled-Section 8
Status Date:
11-25-1988
Filing Date:
Registration Number:
1193497
Registration Date:
04-13-1982
Copper Clad Laminates Comprising an Insulative Substrate, Epoxy Resin and Outer Layers of Copper Foil
Mark Description:
N/A
Class:
Common metals and their alloys
Type of Mark:
Trademark
Published for Opposition Date:
12-25-1979
Owner:
Mark Drawing Status:
Typed Drawing
Abandon Date:
N/A
Business Name:
N/A
Correspondent Name:
