Serial Number:
88771443
Mark:
HIGH DENSITY VIA PATTERN (HDVP)
Status:
Abandoned-Failure to Respond
Status Date:
11-01-2021
Filing Date:
Registration Number:
N/A
Registration Date:
N/A
Printed circuit boards; electronic back panel assemblies, namely, graphics cards, video display cards, electronic circuit cards, all for use with personal computers and personal cellular telephones; electronic wire harnesses and custom electronic cable assemblies comprised of electric connectors, electrical adapters, connection cables, cable connectors and electrical connectors; and custom electronic enclosures, namely, cases for panel mounted, electronic instruments in the nature of logic analyzers Manufacture of printed circuit boards, electronic backpanel assemblies, electronic wire harnesses, custom electronic cable assemblies, and custom electronic enclosures to order and/or specifications of others
Mark Description:
N/A
Class:
Treatment of materials.
Type of Mark:
Trademark
Published for Opposition Date:
N/A
Owner:
Mark Drawing Status:
Standart Character Mark
Abandon Date:
10-20-2021
Business Name:
POLSINELLI PC
Correspondent Name:
