I-SYNC
associated with 33 other trademarks
Resin based laminates and prepreg films and sheets, with and without copper cladding, for use in manufacturing printed circuit boards

Words that describe this trademark:

copper cladding  resin based  films  laminates  prepreg  sheets  based  cladding  without  manufacturing 

Serial Number:

85849656

Mark:

I-SYNC

Status:

Abandoned-No Statement of Use filed

Status Date:

04-28-2014

Filing Date:

Registration Number:

N/A

Registration Date:

N/A

Goods and Services:

Resin based laminates and prepreg films and sheets, with and without copper cladding, for use in manufacturing printed circuit boards

Mark Description:

N/A

Class:

Rubber

Type of Mark:

Trademark

Published for Opposition Date:

07-30-2013

Mark Drawing Status:

Standart Character Mark

Abandon Date:

04-28-2014

Business Name:

MCDONNELL BOEHNEN HULBERT & BERGHOFF

Correspondent Name:

Recent Trademark filings by this company