Mark:

LAIRD PERFORMANCE MATERIALS

Status Date:

08-21-2023

Registration Number:

N/A

Goods and Services:

Microwave absorbers, namely, pastes, pads, gels, and molded and extruded shapes, comprised of foams, elastomers, and polymers loaded with magnetic particles; conductive materials, namely, fabric over foam contacts, foil over foam contacts, spring contacts, and surface mount device contacts for providing an electrical connection between two surfaces in electronic devices; dielectric materials, namely, conducting and protective interlayer conductive materials and coatings for use in integrated circuits, semiconductor devices, computer disk drives, and other computer hardware; conductive foam, namely, sheets, pads, strips, and die-cut shapes, for use in conducting heat and electricity; surface gasket in the nature of fabric over foam gaskets, synthetic elastomer gaskets; conductive tapes, namely, conductive tape for electromagnetic radiation shielding in electronic products; decorative electromagnetic interference (EMI) shielding metals, namely, conductive metal sheets having a decorative finish thereon, for EMI shielding in electronics; structural electromagnetic interference (EMI) shielding metals, namely, in the form of metal board level shields; electromagnetic interference (EMI) shielding products, namely, electromagnetic interference (EMI) shielding contacts, electromagnetic interference (EMI) spring contacts, electromagnetic interference (EMI) shielding user interface shields, electromagnetic interference (EMI) combination shields, electromagnetic interference (EMI) shielding gaskets, electromagnetic interference (EMI) board level shielding and customer designed electromagnetic interference (EMI) shielding; electromagnetic interference shielding gaskets, namely, electromagnetic interference (EMI) fabric over foam gaskets and electromagnetic interference (EMI) fingerstocks; electromagnetic interference (EMI) spring contacts; conductive elastomers, namely, synthetic elastomers in the form of pads, or as molded, die cut or extruded shapes, for use as components in electronics, and putties, greases, pads, and sheets for use in the management of electromagnetic radiation and heat in electronic devices; form-in place gaskets, namely, form-in-place non-metal gaskets for electronic devices; electromagnetic interference (EMI) shielding wire mesh and knitted wire, namely, in the form of gaskets; electromagnetic interference (EMI) shielding knitted gaskets; combination electromagnetic interference (EMI) shielding products, namely, EMI shielding contacts, EMI spring contacts, EMI shielding user interface shields and EMI combination shields, EMI board level shielding and customer designed EMI shielding; electromagnetic interference (EMI) vent panels, namely, metal plated rigid structures that provide EMI shielding and permit air flow to electronic components; electromagnetic interference (EMI) microwave products in the nature of plastics, elastomers, epoxies and polyurethane materials for use in absorbing electromagnetic radiation in electronic devices; electromagnetic interference (EMI) metallized fabric, namely, nylon or polyester fabric impregnated with metal cut or shaped to form an EMI shield in electronic devices; electromagnetic interference (EMI) conductive tape, namely, adhesive shielding tape for electromagnetic radiation shielding in electronic products; thermal interface materials, thermally conductive silicone gap fillers for industrial and commercial use; thermal interface materials, namely, phase change thermal interface materials; thermal gap filler pad thermal interface materials, namely, thermally conductive silicone gap fillers for industrial and commercial use; electrically insulating thermal interface materials and electrically conductive thermal interface materials, low thermal resistance interface pads, tapes, sheets, films, and coatings for use as heat transfer interfaces between electronic components and thermal dissipation members; thermally conductive printed circuit board (PCB) materials, namely, films and sheets made out of resins for use in manufacturing electronic circuit boards; thermally conductive thermoplastics, namely, semiprocesssed thermoplastics in molded, extruded, and sheet form; thermal and electrically conductive materials for use in electrical and electronic applications, namely, low thermal resistance interface pads, tapes, sheets, films, and coatings for use as heat transfer interfaces between electronic components and thermal dissipation members

Class:

Rubber

Published for Opposition Date:

05-26-2020

Mark Drawing Status:

Standart Character Mark

Business Name:

HARNESS, DICKEY & PIERCE, P.L.C.