Serial Number:
88615808
Mark:
M MICROBOND
Status:
Abandoned-No Statement of Use filed
Status Date:
10-03-2022
Filing Date:
Registration Number:
N/A
Registration Date:
N/A
lead-free solder in the electronics industry Hard solder; soft solder; lead-free solder being solder wires; soldering metals, namely, soldering metals in bar form; soldering alloys, namely, soldering metal alloy rods and wire; solder rods of metal; solder wires; solder wires with built-in flux; common metals in powder form; hard solder powder; solder balls; soldering pastes; soldering creams Soldering agent preparations; soldering preparations; soldering composition preparations
Mark Description:
The mark consists of a stylized letter "M" in blue appearing above the term "MICROBOND" in gray.
Class:
Scientific
Type of Mark:
Trademark
Published for Opposition Date:
07-07-2020
Mark Drawing Status:
Design plus Words, Letters, and/or Numbers
Abandon Date:
10-03-2022
Business Name:
KIRSCHSTEIN ISRAEL SCHIFFMILLER & PIERON
Correspondent Name:
