Serial Number:
75734567
Mark:
PILLAR BUMP
Status:
Abandoned-Failure to Respond
Status Date:
08-12-2000
Filing Date:
Registration Number:
N/A
Registration Date:
N/A
TRADEMARK INDICATES A CONNECTION BUILD UP BY ELECTROPLATING CONDUCTIVE MATERIAL ON INTEGRATED CIRCUITS (IC) AT THE WAFER LEVEL AND CIRCUIT BOARD OR LAMINATES THIS CONNECTION IS CALLED PILLAR BUMP BECAUSE OF THE TALL HEIGHT BUILD UP AND FLEXIBLE COMPOSITION ACHIEVED DURING ELECTROPLATING
Mark Description:
N/A
Class:
Treatment of materials.
Type of Mark:
Servicemark
Published for Opposition Date:
N/A
Mark Drawing Status:
Words, Letters, and/or Numbers in Stylized From
Abandon Date:
05-08-2000
Business Name:
CORPORATION
Correspondent Name:
