PILLAR BUMP
associated with 1 other trademarks
MANUFACTURING FOR OTHERS, NAMELY, ELECTROPLATING CONDUCTIVE MATERIAL ON INTEGRATED CIRCUITS AT THE WAFER LEVEL

Words that describe this trademark:

wafer level  integrated circuits  conductive material  material  level  circuits  electroplating  manufacturing 

Serial Number:

76035876

Mark:

PILLAR BUMP

Status:

Abandoned-Failure to Respond

Status Date:

02-05-2002

Filing Date:

Registration Number:

N/A

Registration Date:

N/A

Goods and Services:

MANUFACTURING FOR OTHERS, NAMELY, ELECTROPLATING CONDUCTIVE MATERIAL ON INTEGRATED CIRCUITS AT THE WAFER LEVEL

Mark Description:

N/A

Class:

Treatment of materials.

Type of Mark:

Servicemark

Published for Opposition Date:

N/A

Mark Drawing Status:

Typed Drawing

Abandon Date:

10-03-2001

Business Name:

SKJERVEN MORRILL MACPHERSON LLPP.C.

Correspondent Name:

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