POWERSEMI
associated with 15 other trademarks
Providing grinding, polishing, lapping, sawing and slicing services for semi-conductor wafers, substrates, and silicon carbide for others Grinding, po...

Words that describe this trademark:

grinding polishing  polishing lapping  slicing machines  machines  lapping  sawing 

Serial Number:

90791129

Mark:

POWERSEMI

Status:

Abandoned-After Publication

Status Date:

09-13-2023

Filing Date:

Registration Number:

N/A

Registration Date:

N/A

Goods and Services:

Providing grinding, polishing, lapping, sawing and slicing services for semi-conductor wafers, substrates, and silicon carbide for others Grinding, polishing, lapping, sawing and wire slicing machines; Grinding, polishing, lapping, sawing and slicing machines for processing semi-conductor wafers and substrates; Grinding, polishing, lapping, sawing and slicing machines for processing semi-conductor silicon carbide Retail and online retail store services featuring silicon carbide

Mark Description:

The mark consists of the word "PowerSemi" wherein there are 3 conjoined circles to the right of "Power". The letter "S" from "Semi" is inside of the third circle. The dot in the "i" in "Semi" is comprised of a diagonal oval.

Class:

Treatment of materials.

Type of Mark:

Trademark

Published for Opposition Date:

04-18-2023

Mark Drawing Status:

Design plus Words, Letters, and/or Numbers

Abandon Date:

09-11-2023

Business Name:

LEYDIG, VOIT & MAYER, LTD.

Correspondent Name:

Recent Trademark filings by this company