Serial Number:
73215168
Mark:
PREFLOW
Status:
Cancelled-Section 8
Status Date:
05-18-2002
Filing Date:
Registration Number:
1153755
Registration Date:
05-12-1981
Sealing Lids of Conductive or Nonconductive Material for Hermetically Sealing a Semiconductor Chip in a Recessed Package
Mark Description:
N/A
Class:
Scientific
Type of Mark:
Trademark
Published for Opposition Date:
02-17-1981
Mark Drawing Status:
Typed Drawing
Abandon Date:
N/A
Business Name:
N/A
Correspondent Name:
