PYXIS
By: TESSERA, INC.
associated with 54 other trademarks
MULTI-DIE ELECTRONIC SUB-ASSEMBLIES, MULTI-CHIP MODULES, MULTI-CHIP PACKAGES AND INTEGRATED CIRCUITS ALL FOR USE AS COMPONENTS BY ELECTRONICS EQUIPMEN...

Words that describe this trademark:

integrated circuits  components electronics  circuits components  electronic subassemblies  electronics equipment  multichip modules  packages  subassemblies  multichip  modules 

Serial Number:

78244392

Mark:

PYXIS

Status:

Abandoned-After inter partes decision

Status Date:

07-10-2006

Filing Date:

Registration Number:

N/A

Registration Date:

N/A

Goods and Services:

MULTI-DIE ELECTRONIC SUB-ASSEMBLIES, MULTI-CHIP MODULES, MULTI-CHIP PACKAGES AND INTEGRATED CIRCUITS ALL FOR USE AS COMPONENTS BY ELECTRONICS EQUIPMENT MANUFACTURERS TO ASSIST INFORMATION PROCESSING

Mark Description:

N/A

Class:

Scientific

Type of Mark:

Trademark

Published for Opposition Date:

09-14-2004

Owner:

Mark Drawing Status:

Typed Drawing

Abandon Date:

07-10-2006

Business Name:

LERNER, DAVID, LITTENBERG, KRUMHOLZ & ME

Correspondent Name:

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