SHINKAWA
associated with 1 other trademarks
Semiconductor manufacturing machines and systems comprised of die-bonders, wire bonders, chip on film bonders, flip chip bonders, bump bonders, discre...

Words that describe this trademark:

manufacturing machines  wire bonders  semiconductor manufacturing  chip film  systems  comprised  machines  film  bonders 

Serial Number:

79038532

Mark:

SHINKAWA

Status:

Status Date:

03-28-2017

Filing Date:

Registration Number:

3458277

Registration Date:

07-01-2008

Goods and Services:

Semiconductor manufacturing machines and systems comprised of die-bonders, wire bonders, chip on film bonders, flip chip bonders, bump bonders, discreet assemblers, package sorters, tape bonders and die transferring machines Repair or maintenance of integrated circuit manufacturing machines and systems; repair or maintenance of semiconductor manufacturing machines and systems

Mark Description:

N/A

Class:

Building construction

Type of Mark:

Trademark

Published for Opposition Date:

04-15-2008

Mark Drawing Status:

Words, Letters, and/or Numbers in Stylized From

Abandon Date:

N/A

Business Name:

QUINN EMANUEL URQUHART OLIVER & HEDGES L

Recent Trademark filings by this company