TEMPRION
associated with 39 other trademarks
THERMALLY CONDUCTIVE POLYMERIC-BASED ADHESIVES AND GAP FILLERS USED FOR HEAT TRANSFER APPLICATIONS IN ELECTRONIC COMPONENTS

Words that describe this trademark:

heat transfer applications  electronic components  thermally conductive  gap fillers  used heat  transfer applications  conductive  applications  fillers  adhesives 

Serial Number:

86829101

Mark:

TEMPRION

Status:

Registered

Status Date:

11-06-2018

Filing Date:

Registration Number:

5601655

Registration Date:

11-06-2018

Goods and Services:

THERMALLY CONDUCTIVE POLYMERIC-BASED ADHESIVES AND GAP FILLERS USED FOR HEAT TRANSFER APPLICATIONS IN ELECTRONIC COMPONENTS

Mark Description:

N/A

Class:

Chemicals

Type of Mark:

Trademark

Published for Opposition Date:

02-02-2016

Mark Drawing Status:

Standart Character Mark

Abandon Date:

N/A

Business Name:

N/A

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