Mark:

THERMAGON

Status Date:

11-02-2022

Registration Number:

N/A

Goods and Services:

Conductive silicon packing for managing electro-magnetic interference Thermally conductive thermoplastics, namely, semi-processed thermoplastics in molded, extruded and sheet form; Microwave absorbers, namely, pastes, pads, gels, and molded / extruded shapes, comprised of foams, elastomers, and polymers loaded with magnetic particles; Conducting and protective interlayer conductive materials and coatings for use in integrated circuits, semiconductor devices, computer disk drives and other computer hardware; Conductive contacts, namely, fabric over foam contacts, foil over foam contacts, spring contacts, and surface mount device contacts, for providing an electrical connection between two surfaces in electronic devices; Insulating and protective interlayer dielectric materials and coatings for use in integrated circuits, semiconductor devices, computer disk drives and other computer hardware; Conductive foam, namely, sheets, pads, strips, and die-cut shapes, for use in conducting heat and electricity; Conductive tape for electromagnetic radiation shielding in electronic products; Decorative electromagnetic interference (EMI) shielding metals, namely, conductive metal sheets having a decorative finish thereon, for EMI shielding in electronics; structural EMI shielding metals, namely, in the form of metal board level shields; EMI shielding wire mesh and knitted wire, namely, in the form of gaskets; Electromagnetic interference (EMI) shielding products, namely, EMI shielding contacts, EMI spring contacts, EMI shielding user interface shields and EMI combination shields, EMI board level shielding and customer designed EMI shielding; Electromagnetic interference shielding gaskets, namely, fabric over foam gaskets, foil over film gaskets, and fingerstocks; conductive elastomers, namely, synthetic elastomers in the form of pads, or as molded, die cut or extruded shapes, for use as components in electronics; Form-in-place non-metal gaskets for electronic devices; Vent panels, namely, metal plated rigid structures that provide EMI shielding and permit air flow to electronic components; Thermal interface materials and phase change thermal interface materials, namely, low thermal resistance interface pads, tapes, sheets, films, and coatings for use as heat transfer interfaces between electronic components and thermal dissipation members; Thermal gap filler pad thermal interface materials, namely, thermally conductive silicone gap fillers for industrial and commercial use; electrically insulating thermal interface materials and electrically conductive thermal interface materials, namely, low thermal resistance interface pads, tapes, sheets, films, and coatings for use as heat transfer interfaces between electronic components and thermal dissipation members; Thermally conductive PCB (printed circuit board) materials, namely, films and sheets made out of resins for use in manufacturing electronic circuit boards; Thermally conductive thermoplastics, namely, semi-processed thermoplastics in molded, extruded, and sheet form; Conductive plastics and elastomers, namely, putties, greases, pads, and sheets for use in the management of electromagnetic radiation and heat in electronic devices; absorbing plastics and elastomers for use in absorbing electromagnetic radiation in electronic devices

Class:

Rubber

Published for Opposition Date:

N/A

Mark Drawing Status:

Standart Character Mark

Business Name:

HARNESS, DICKEY & PIERCE, P.L.C.