Serial Number:
78927453
Mark:
TIMBOND
Status:
Abandoned-No Statement of Use filed
Status Date:
11-24-2008
Filing Date:
Registration Number:
N/A
Registration Date:
N/A
Solder fluxes; solder fluxes for use in heat sink soldering applications in electronics manufacture; solder fluxes for use in low temperature applications Solder pastes, solder creams; solder pastes and solder creams for use in heat sink soldering applications in electronics manufacture; solder pastes and solder creams for use in low temperature applications
Mark Description:
N/A
Class:
Common metals and their alloys
Type of Mark:
Trademark
Published for Opposition Date:
07-31-2007
Owner:
Mark Drawing Status:
Standart Character Mark
Abandon Date:
11-24-2008
Business Name:
LEYDIG VOIT & MAYER, LTD
Correspondent Name: