TIMBOND
associated with 2 other trademarks
Solder fluxes; solder fluxes for use in heat sink soldering applications in electronics manufacture; solder fluxes for use in low temperature applicat...

Words that describe this trademark:

solder fluxes  electronics manufacture  heat sink  applications  soldering  manufacture  fluxes  sink 

Serial Number:

78927453

Mark:

TIMBOND

Status:

Abandoned-No Statement of Use filed

Status Date:

11-24-2008

Filing Date:

Registration Number:

N/A

Registration Date:

N/A

Goods and Services:

Solder fluxes; solder fluxes for use in heat sink soldering applications in electronics manufacture; solder fluxes for use in low temperature applications Solder pastes, solder creams; solder pastes and solder creams for use in heat sink soldering applications in electronics manufacture; solder pastes and solder creams for use in low temperature applications

Mark Description:

N/A

Class:

Common metals and their alloys

Type of Mark:

Trademark

Published for Opposition Date:

07-31-2007

Mark Drawing Status:

Standart Character Mark

Abandon Date:

11-24-2008

Business Name:

LEYDIG VOIT & MAYER, LTD

Correspondent Name:

Recent Trademark filings by this company