Serial Number:
75799571
Mark:
UP
Status:
Abandoned-No Statement of Use filed
Status Date:
09-20-2002
Filing Date:
Registration Number:
N/A
Registration Date:
N/A
PLASTIC THERMOFORMED STATIC DISSIPATIVE PACKAGING; PLASTIC THERMOFORMED PACKAGING FOR THE ELECTRONICS, SEMICONDUCTOR, AND TELECOMMUNICATIONS INDUSTRIES DESIGN AND CONSULTATION FOR OTHERS IN THE FIELD OF STATIC DISSIPATIVE PACKAGING; DESIGN AND CONSULTATION IN THE FIELD OF PACKAGING FOR THE ELECTRONICS, SEMICONDUCTOR AND TELECOMMUNICATIONS INDUSTRIES
Mark Description:
N/A
Class:
Scientific and technological services
Type of Mark:
Trademark
Published for Opposition Date:
01-09-2001
Mark Drawing Status:
3S17
Abandon Date:
09-20-2002
Business Name:
REED SMITH LLP
Correspondent Name:
