Serial Number:
79069811
Mark:
WFOP
Status:
Status Date:
04-03-2019
Filing Date:
Registration Number:
3761473
Registration Date:
03-16-2010
Semi-conductor packages consisting of semi-conductors arranged in layers with solder ball and copper wire used to mount and interconnect the semi-conductor layers
Mark Description:
N/A
Class:
Scientific
Type of Mark:
Trademark
Published for Opposition Date:
12-29-2009
Owner:
Mark Drawing Status:
Standart Character Mark
Abandon Date:
N/A
Business Name:
TERASAKI BLDG. NO.2, 4TH FLOOR
Correspondent Name:
